Miroslav Haluska: Catalogue data in Autumn Semester 2017
|Name||Dr. Miroslav Haluska|
Chair in Micro and Nanosystems
ETH Zürich, CLA G 3
|Telephone||+41 44 632 76 40|
|Department||Mechanical and Process Engineering|
|151-0620-00L||Embedded MEMS Lab||5 credits||3P||C. Hierold, S. Blunier, M. Haluska|
|Abstract||Practical course: Students are introduced to the process steps required for the fabrication of MEMS (Micro Electro Mechanical System) and carry out the fabrication and testing steps in the clean rooms by themselves. Additionally, they learn the requirements for working in clean rooms. Processing and characterization will be documented and analyzed in a final report. Limited access|
|Objective||Students learn the individual process steps that are required to make a MEMS (Micro Electro Mechanical System). Students carry out the process steps themselves in laboratories and clean rooms. Furthermore, participants become familiar with the special requirements (cleanliness, safety, operation of equipment and handling hazardous chemicals) of working in the clean rooms and laboratories. The entire production, processing, and characterization of the MEMS is documented and evaluated in a final report.|
|Content||With guidance from a tutor, the individual silicon microsystem process steps that are required for the fabrication of an accelerometer are carried out:|
- Photolithography, dry etching, wet etching, sacrificial layer etching, various cleaning procedures
- Packaging and electrical connection of a MEMS device
- Testing and characterization of the MEMS device
- Written documentation and evaluation of the entire production, processing and characterization
|Lecture notes||A document containing theory, background and practical course content is distributed at the first meeting of the course.|
|Literature||The document provides sufficient information for the participants to successfully participate in the course.|
|Prerequisites / Notice||Participating students are required to attend all scheduled lectures and meetings of the course. |
Participating students are required to provide proof that they have personal accident insurance prior to the start of the laboratory portion of the course.
This master's level course is limited to 15 students per semester for safety and efficiency reasons.
If there are more than 15 students registered, we regret to restrict access to this course by the following rules:
Priority 1: master students of the master's program in "Micro and Nanosystems"
Priority 2: master students of the master's program in "Mechanical Engineering" with a specialization in Microsystems and Nanoscale Engineering (MAVT-tutors Profs Daraio, Dual, Hierold, Koumoutsakos, Nelson, Norris, Park, Poulikakos, Pratsinis, Stemmer), who attended the bachelor course "151-0621-00L Microsystems Technology" successfully.
Priority 3: master students, who attended the bachelor course "151-0621-00L Microsystems Technology" successfully.
Priority 4: all other students (PhD, bachelor, master) with a background in silicon or microsystems process technology.
If there are more students in one of these priority groups than places available, we will decide by (in following order) best achieved grade from 151-0621-00L Microsystems Technology, registration to this practicum at previous semester, and by drawing lots.
Students will be notified at the first lecture of the course (introductory lecture) as to whether they are able to participate.
The course is offered in autumn and spring semester.
|151-0621-00L||Microsystems I: Process Technology and Integration||6 credits||3V + 3U||M. Haluska, C. Hierold|
|Abstract||Students are introduced to the fundamentals of semiconductors, the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow).|
|Objective||Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow).|
|Content||- Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS)|
- Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition.
- Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical properties.
Application of selected technologies will be demonstrated on case studies.
|Lecture notes||Handouts (available online)|
|Literature||- S.M. Sze: Semiconductor Devices, Physics and Technology|
- W. Menz, J. Mohr, O.Paul: Microsystem Technology
- Hong Xiao: Introduction to Semiconductor Manufacturing Technology
- M. J. Madou: Fundamentals of Microfabrication and Nanotechnology, 3rd ed.
- T. M. Adams, R. A. Layton: Introductory MEMS, Fabrication and Applications
|Prerequisites / Notice||Prerequisites: Physics I and II|