151-0621-00L  Microsystems Technology

SemesterAutumn Semester 2014
LecturersC. Hierold, M. Haluska
Periodicityyearly recurring course
Language of instructionEnglish


AbstractStudents are introduced to the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow).
ObjectiveStudents are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow).
Content- Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS)
- Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition.
- Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical and thermal properties, piezoelectric and piezoresitive materials.
- Selected microsystems: Mechanical sensors and actuators, microresonators, thermal sensors and actuators, system integration and encapsulation.
Lecture notesHandouts (available online)
Literature- S.M. Sze: Semiconductor Devices, Physics and Technology
- W. Menz, J. Mohr, O.Paul: Microsystem Technology
- G. Kovacs: Micromachined Transducer Sourcebook
Prerequisites / NoticePrerequisites: Physics I and II