Suchergebnis: Katalogdaten im Frühjahrssemester 2015

Elektrotechnik und Informationstechnologie Master Information
Fächer der Vertiefung
Insgesamt 42 KP müssen im Masterstudium aus Vertiefungsfächern erreicht werden. Der individuelle Studienplan unterliegt der Zustimmung eines Tutors.
Electronics and Photonics
Kernfächer
Diese Fächer sind besonders Empfohlen, um sich in "Electronics and Photonics" zu vertiefen.
NummerTitelTypECTSUmfangDozierende
227-0111-00LCommunication Electronics Information W6 KP2V + 2UQ. Huang
KurzbeschreibungElectronics for communications systems, with emphasis on realization. Low noise amplifiers, modulators and demodulators, transmit amplifiers and oscillators are discussed in the context of wireless communications. Wireless receiver, transmitter and frequency synthesizer will be described. Importance of and trade offs among sensitivity, linearity and selectivity are discussed extensively.
LernzielFoundation course for understanding modern electronic circuits for communication applications. We learn how theoretical communications principles are reduced to practice using transistors, switches, inductors, capacitors and resistors. The harsh environment such communication electronics will be exposed to and the resulting requirements on the sensitivity, linearity and selectivity help explain the design trade offs encountered in every circuit block found in a modern transceiver.
InhaltAccounting for more than two trillion dollars per year, communications is one of the most important drivers for advanced economies of our time. Wired networks have been a key enabler to the internet age and the proliferation of search engines, social networks and electronic commerce, whereas wireless communications, cellular networks in particular, have liberated people and increased productivity in developed and developing nations alike. Integrated circuits that make such communications devices light weight and affordable have played a key role in the proliferation of communications.
This course introduces our students to the key components that realize the tangible products in electronic form. We begin with an introduction to wireless communications, and describe the harsh environment in which a transceiver has to work reliably. In this context we highlight the importance of sensitivity or low noise, linearity, selectivity, power consumption and cost, that are all vital to a competitive device in such applications.
We shall review bipolar and MOS devices from a designer's prospectives, before discussing basic amplifier structures - common emitter/source, common base/gate configurations, their noise performance and linearity, impedance matching, and many other things one needs to know about a low noise amplifier.
We will discuss modulation, and the mixer that enables its implementation. Noise and linearity form an inseparable part of the discussion of its design, but we also introduce the concept of quadrature demodulator, image rejection, and the effects of mismatch on performance.
When mixers are used as a modulator the signals they receive are usually large and the natural linearity of transistors becomes insufficient. The concept of feedback will be introduced and its function as an improver of linearity studied in detail.
Amplifiers in the transmit path are necessary to boost the power level before the signal leaves an integrated circuit to drive an even more powerful amplifier (PA) off chip. Linearized pre-amplifiers will be studied as part of the transmitter.
A crucial part of a mobile transceiver terminal is the generation of local oscillator signals at the desired frequencies that are required for modulation and demodulation. Oscillators will be studied, starting from stability criteria of an electronic system, then leading to criteria for controlled instability or oscillation. Oscillator design will be discussed in detail, including that of crystal controlled oscillators which provide accurate time base.
An introduction to phase-locked loops will be made, illustrating how it links a variable frequency oscillator to a very stable fixed frequency crystal oscillator, and how phase detector, charge pump and programmable dividers all serve to realize an agile frequency synthesizer that is very stable in each frequency synthesized.
SkriptScript with slides and notes is available.
Voraussetzungen / BesonderesThe course Analog Integrated Circuits is recommended as preparation for this course.
227-0146-00LAnalog-to-Digital Converters Information W6 KP2V + 2UQ. Huang, T. Burger
KurzbeschreibungThis course provides a thorough treatment of integrated data conversion systems from system level specifications and trade-offs, over architecture choice down to circuit implementation.
LernzielData conversion systems are substantial sub-parts of many electronic systems, e.g. the audio conversion system of a home-cinema systems or the base-band front-end of a wireless modem. Data conversion systems usually determine the performance of the overall system in terms of dynamic range and linearity. The student will learn to understand the basic principles behind data conversion and be introduced to the different methods and circuit architectures to implement such a conversion. The conversion methods such as successive approximation or algorithmic conversion are explained with their principle of operation accompanied with the appropriate mathematical calculations, including the effects of non-idealties in some cases. After successful completion of the course the student should understand the concept of an ideal ADC, know all major converter architectures, their principle of operation and what governs their performance.
Inhalt- Introduction: information representation and communication; abstraction, categorization and symbolic representation; basic conversion algorithms; data converter application; tradeoffs among key parameters; ADC taxonomy.
- Dual-slope & successive approximation register (SAR) converters: dual slope principle & converter; SAR ADC operating principle; SAR implementation with a capacitive array; range extension with segmented array.
- Algorithmic & pipelined A/D converters: algorithmic conversion principle; sample & hold stage; pipe-lined converter; multiplying DAC; flash sub-ADC and n-bit MDAC; redundancy for correction of non-idealties, error correction.
- Performance metrics and non-linearity: ideal ADC; offset, gain error, differential and integral non-linearities; capacitor mismatch; impact of capacitor mismatch on SAR ADC's performance.
- Flash, folding an interpolating analog-to-digital converters: flash ADC principle, thermometer to binary coding, sparkle correction; limitations of flash converters; the folding principle, residue extraction; folding amplifiers; cascaded folding; interpolation for folding converters; cascaded folding and interpolation.
- Noise in analog-to-digital converters: types of noise; noise calculation in electronic circuit, kT/C-noise, sampled noise; noise analysis in switched-capacitor circuits; aperture time uncertainty and sampling jitter.
- Delta-sigma A/D-converters: linearity and resolution; from delta-modulation to delta-sigma modulation; first-oder delta-sigma modulation, circuit level implementation; clock-jitter & SNR in delta-sigma modulators; second-order delta-sigma modulation, higher-order modulation, design procedure for a single-loop modulator.
- Digital-to-analog converters: introduction; current scaling D/A converter, current steering DAC, calibration for improved performance.
SkriptHandouts of the slides will be distributed.
Literatur- B. Razavi, Principles of Data Conversion System Design, IEEE Press, 1994
- M. Gustavsson et. al., CMOS Data Converters for Communications, Springer, 2010
- R.J. van de Plassche, CMOS Integrated Analog-to-Digital and Digital-to-Analog Converters, Springer, 2010
Voraussetzungen / BesonderesIt is highly recommended to attend the course "Analog Integrated Circuits" of Prof. Huang as a preparation for this course.
227-0148-00LVLSI III: Test and Fabrication of VLSI Circuits Information W6 KP4GN. Felber, H. Kaeslin
KurzbeschreibungDie letzte der drei Lehrveranstaltungen behandelt die Herstellung von integrierten Schaltungen (IC) in CMOS Technologie, die dabei möglicherweise auftretenden Defekte, sowie vor allem Verfahren und Werkzeuge zum Erkennen von Entwurfsfehlern und Fabrikationsdefekten.
LernzielBeherrschen von Methoden, Software-Werkzeugen und Apparaturen zum testgerechten Entwurf von VLSI Schaltungen, zum Prüfen fabrizierter digitaler ICs, sowie zur physikalischen Analyse im Fehlerfall. Grundwissen über moderne Halbleitertechnologien.
InhaltDiese letzte von drei Vorlesungen geht auf CMOS Fabrikationstechnologie, die Prüfung, die physikalische Analyse und Verpackungstechnik von VLSI Schaltungen ein. Künftige Entwicklungsmöglichkeiten der Mikro- und Nanoelektronik werden ebenfalls aufgezeigt. Behandelt werden:
- Auswirkung von Fabrikationsfehlern.
- Abstraktion vom physikalischen Fehlermodell zu solchen auf Transistor- und Gatterniveau.
- Fehlersimulation an grossen ASICs.
- Erzeugung effizienter Testvektoren.
- Verbesserung der Testbarkeit durch eingebaute Testmechanismen.
- Aufbau und Einsatz von IC-Testern.
- Physikalische Analyse von Bauelementen.
- Verpackungsprobleme und Lösungen.
- Heutige Nanometer CMOS Fabrikationsprozesse (HKMG).
- Optische und post-optische Photolithographie.
- Mögliche Alternativen zur CMOS Technik und MOSFETs.
- Entwicklungsrichtungen für den Schaltungsentwurf.
- Industrielle Planungsgrundlagen für die Weiterentwicklung der Halbleitertechnologie (ITRS).

In den Übungen werden Softwaretools und ASIC-Testgeräte eingesetzt zur Verifikation der Schaltungen nach deren Fabrikation - so weit vorhanden des eigenen ICs aus der Semesterarbeit im 7. Semester. Physikalische Analysemethoden mit professionellem Equipment (AFM, DLTS) vervollständigen die Ausbildung.
SkriptEnglischsprachiges Vorlesungsskript.

Sämtliche Unterlagen in englischer Sprache.
Voraussetzungen / BesonderesVoraussetzungen:
Grundkenntnisse in digitaler Schaltungstechnik.

Weiterführende Informationen:
http://www.iis.ee.ethz.ch/stud_area/vorlesungen/vlsi3.en.html
227-0159-00LQuantum Transport in Nanoscale Devices Information W6 KP2V + 2UM. Luisier
KurzbeschreibungThis class offers an introduction into quantum transport theory, a rigorous approach to electron transport at the nanoscale. It covers different topics such as bandstructure, Wave Function and Non-equilibrium Green's Function formalisms, and electron interactions with their environment. Matlab exercises accompany the lectures where students learn how to develop their own transport simulator.
LernzielThe continuous scaling of electronic devices has given rise to structures whose dimensions do not exceed a few atomic layers. At this size, electrons do not behave as particle any more, but as propagating waves and the classical representation of electron transport as the sum of drift-diffusion processes fails. The purpose of this class is to explore and understand the displacement of electrons through nanoscale device structures based on state-of-the-art quantum transport methods and to get familiar with the underlying equations by developing his own nanoelectronic device simulator.
InhaltThe following topics will be addressed:
- Introduction to quantum transport modeling
- Bandstructure representation and effective mass approximation
- Open vs closed boundary conditions to the Schrödinger equation
- Comparison of the Wave Function and Non-equilibrium Green's Function formalisms as solution to the Schrödinger equation
- Self-consistent Schödinger-Poisson simulations
- Quantum transport simulations of resonant tunneling diodes and quantum well nano-transistors
- Top-of-the-barrier simulation approach to nano-transistor
- Electron interactions with their environment (phonon, roughness, impurity,...)
- Multi-band transport models
SkriptLecture slides are distributed every week and can be found at
http://www.iis.ee.ethz.ch/stud_area/vorlesungen/electransport.en.html
LiteraturRecommended textbook: "Electronic Transport in Mesoscopic Systems", Supriyo Datta, Cambridge Studies in Semiconductor Physics and Microelectronic Engineering, 1997
Voraussetzungen / BesonderesBasic knowledge of semiconductor device physics and quantum mechanics
227-0456-00LHigh Frequency and Microwave Electronics I Information
Findet dieses Semester nicht statt.
W6 KP4GC. Bolognesi
KurzbeschreibungUnderstanding of basic building blocks of microwave electronics technology, with a focus on active semiconductor devices.
LernzielUnderstanding the fundamentals of microwave electronics technology, with emphasis on active components.
InhaltIntroduction, microstrip transmission lines, matching, semiconductors, pn-junction, noise, PIN-diode and applications, Schottky diodes and detectors, bipolar transistors and heterojunction bipolar transistors, MESFET physics and properties, high-electron mobility transistors, microwave amplifiers.
SkriptScript: Mikrowellentechnik and Mikrowellenelektronik, by Werner Bächtold
(In German).
Voraussetzungen / BesonderesThe lectures will be held in English.
227-0198-00LWearable Systems II: Design and Implementation Information W6 KP4GG. Tröster
KurzbeschreibungIntegrationskonzepte und -Technologien mobiler Computer in der Kleidung.
Textile Sensoren: Dehnung, Druck, Temperatur; EKG, EMG
neue Substrate (eTextile, Smart Textile), organisches Material (Folien)
Leistung und Energie in Wearable Systemen.
Ökonomische Randbedingungen
Bewertung und Konzeption von Forschungsinstitutionen, -Projekten und -Anträgen
LernzielUm Wearable Computer auch kommerziell erfolgreich in Kleidung integrieren zu können, sind neben innovativen Aufbau- und Kommunikationstechnologien auch ökonomische und ethische Aspekte zu berücksichtigen.

Wir werden folgende Themen behandeln:
> Textile Sensoren: Dehnung, Druck, Temperatur; EKG, EMG, ...
> Aufbautechnologien: neue Substrate (eTextiles, Smart Textile), organisches Material (Folien),
> Leistung und Energie in mobilen Systemen.
> Privatheit

Mit einem Businessplan wollen wir die Kommerzialisierung unserer 'Wearable Computers' durchexerzieren.

Die Veranstaltung findet - unterstützt durch ein wiki-System - als Seminar statt, in dem unter dem Aspekt 'Konzeption eines Forschungsprojektes' die genannten Themen behandelt werden. Ensprechend der ETH-Initiative 'Critical Thinking' werden wir Implementierungskonzept auch in Bezug auf ihren sozialen und wissenschafdtlichen Kontext analysieren. Dabei wechseln sich Präsentationen, Workshops und Diskussionen ab. Anstelle einer mündlichen Prüfung kann eine schriftliche Arbeit in Form eines Forschungsplans verfasst werden.
InhaltUm Wearable Computer auch kommerziell erfolgreich in Kleidung integrieren zu können, sind neben innovativen Aufbau- und Kommunikationstechnologien auch ökonomische und ethische Aspekte zu berücksichtigen.

Wir werden folgende Themen behandeln:
> Textile Sensoren: Dehnung, Druck, Temperatur; EKG, EMG, ...
> Aufbautechnologien: neue Substrate (eTextiles, Smart Textile), organisches Material (Folien),
> Leistung und Energie in mobilen Systemen.
> Privatheit

Mit einem Businessplan wollen wir die Kommerzialisierung unserer 'Wearable Computers' durchexerzieren.

Die Veranstaltung findet - unterstützt durch ein wiki-System - als Seminar statt, in dem unter dem Aspekt 'Konzeption eines Forschungsprojektes' die genannten Themen behandelt werden. Ensprechend der ETH-Initiative 'Critical Thinking' werden wir Implementierungskonzepte auch in Bezug auf ihren sozialen und wissenschafdtlichen Kontext analysieren. Dabei wechseln sich Präsentationen, Workshops und Diskussionen ab. Anstelle einer mündlichen Prüfung kann eine schriftliche Arbeit in Form eines Forschungsplans verfasst werden.
SkriptFür die Kommunikation steht ein wiki-System zur Verfügung; darin enthalten sind Manuskript und Unterlagen zu den Lektionen.
http://www.ife.ee.ethz.ch/education/wearable_systems_2/
LiteraturWird in den Vorlesungsunterlagen zur Verfügung gestellt
Voraussetzungen / BesonderesDie Veranstaltung findet - unterstützt durch ein wiki-System - als Seminar statt, in dem unter dem Aspekt 'Konzeption eines Forschungsprojektes' die genannten Themen behandelt werden. Ensprechend der ETH-Initiative 'Critical Thinking' werden wir Implementierungskonzepte auch in Bezug auf ihren sozialen und wissenschafdtlichen Kontext analysieren. Dabei wechseln sich Präsentationen, Workshops und Diskussionen ab. Anstelle einer mündlichen Prüfung kann eine schriftliche Arbeit in Form eines Forschungsplans verfasst werden.

Es sind keine speziellen Voraussetzungen erforderlich, auch nicht der Besuch der Veranstaltung 'Wearable Systems 1'
151-0172-00LDevices and Systems Information W5 KP4GC. I. Roman, A. Hierlemann
KurzbeschreibungThe students are introduced to the fundamentals and physics of microelectronic devices as well as to microsystems in general (MEMS). They will be able to apply this knowledge for system research and development and to assess and apply principles, concepts and methods from a broad range of technical and scientific disciplines for innovative products.
LernzielThe students are introduced to the fundamentals and physics of microelectronic devices as well as to microsystems in general (MEMS), basic electronic circuits for sensors, RF-MEMS, chemical microsystems, BioMEMS and microfluidics, magnetic sensors and optical devices, and in particular to the concepts of Nanosystems (focus on carbon nanotubes), based on the respective state-of-research in the field. They will be able to apply this knowledge for system research and development and to assess and apply principles, concepts and methods from a broad range of technical and scientific disciplines for innovative products.
InhaltIntroduction to semiconductors, MOSFET transistors
Basic electronic circuits for sensors and microsystems
Transducer Fundamentals
Chemical sensors and biosensors, microfluidics and bioMEMS
RF MEMS
Magnetic Sensors, optical Devices
Nanosystem concepts
Skripthandouts
227-0150-00LAdvanced System-on-chip Design: Integrated Parallel Computing Architectures Information W6 KP4GL. Benini
KurzbeschreibungThe course will cover Digital System-on-Chip architectures: multi-cores, many-cores, GP-GPUs and heterogeneous platforms, with an in-depth view on design tools and methods targeting advanced nanometer-scale technology and system integration options.
LernzielTo provide an in-depth understanding of the links and dependencies between architectures and their silicon implementation and to get an
exposure to state-of-the-art methodologies for designing complex integrated systems using advanced technologies. Practical experience will also be gained through projects assigned on specific topics.
InhaltThe course will cover Digital System-on-Chip architectures, design tools and methods, with an in-depth view on design challenges related to advanced silicon technology and state-of-the-art system integration options (novel storage options, three-dimensional integration, advanced system packaging). The emphasis will be on programmable parallel architectures, namely, multi and many- cores, GPUs, vector accelerators, heterogeneous platforms, and the complex design choices required to achieve scalability and energy proportionality. The course will cover not only circuit, logic and microarchitecture design, but it will also delve into system design, touching on hardware-software tradeoffs and full-system analysis and optimization taking into account non-functional constraints and quality metrics, such as power consumption, thermal dissipation, reliability and variability.
SkriptSlides will be provided to accompany lectures
LiteraturD. Patterson, J. Hennessy, Computer Architecture, Fifth Edition: A Quantitative Approach (The Morgan Kaufmann Series in Computer Architecture and Design), 2011.

D. Patterson, J. Hennessy, Computer Organization and Design, Fifth Edition: The Hardware/Software Interface (The Morgan Kaufmann Series in Computer Architecture and Design), 2013.
Voraussetzungen / BesonderesKnowledge of digital design at the level of "Design of Digital Circuits SS12" is required.

Knowledge of basic VLSI design at the level of "VLSI I: Architectures of VLSI Circuits" is required
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