Search result: Catalogue data in Spring Semester 2015
Electrical Engineering and Information Technology Master | ||||||
Major Courses A total of 42 CP must be achieved form courses during the Master Program. The individual study plan is subject to the tutor's approval. | ||||||
Electronics and Photonics | ||||||
Core Subjects These core subjects are particularly recommended for the field of "Electronics and Photonics". | ||||||
Number | Title | Type | ECTS | Hours | Lecturers | |
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227-0111-00L | Communication Electronics | W | 6 credits | 2V + 2U | Q. Huang | |
Abstract | Electronics for communications systems, with emphasis on realization. Low noise amplifiers, modulators and demodulators, transmit amplifiers and oscillators are discussed in the context of wireless communications. Wireless receiver, transmitter and frequency synthesizer will be described. Importance of and trade offs among sensitivity, linearity and selectivity are discussed extensively. | |||||
Objective | Foundation course for understanding modern electronic circuits for communication applications. We learn how theoretical communications principles are reduced to practice using transistors, switches, inductors, capacitors and resistors. The harsh environment such communication electronics will be exposed to and the resulting requirements on the sensitivity, linearity and selectivity help explain the design trade offs encountered in every circuit block found in a modern transceiver. | |||||
Content | Accounting for more than two trillion dollars per year, communications is one of the most important drivers for advanced economies of our time. Wired networks have been a key enabler to the internet age and the proliferation of search engines, social networks and electronic commerce, whereas wireless communications, cellular networks in particular, have liberated people and increased productivity in developed and developing nations alike. Integrated circuits that make such communications devices light weight and affordable have played a key role in the proliferation of communications. This course introduces our students to the key components that realize the tangible products in electronic form. We begin with an introduction to wireless communications, and describe the harsh environment in which a transceiver has to work reliably. In this context we highlight the importance of sensitivity or low noise, linearity, selectivity, power consumption and cost, that are all vital to a competitive device in such applications. We shall review bipolar and MOS devices from a designer's prospectives, before discussing basic amplifier structures - common emitter/source, common base/gate configurations, their noise performance and linearity, impedance matching, and many other things one needs to know about a low noise amplifier. We will discuss modulation, and the mixer that enables its implementation. Noise and linearity form an inseparable part of the discussion of its design, but we also introduce the concept of quadrature demodulator, image rejection, and the effects of mismatch on performance. When mixers are used as a modulator the signals they receive are usually large and the natural linearity of transistors becomes insufficient. The concept of feedback will be introduced and its function as an improver of linearity studied in detail. Amplifiers in the transmit path are necessary to boost the power level before the signal leaves an integrated circuit to drive an even more powerful amplifier (PA) off chip. Linearized pre-amplifiers will be studied as part of the transmitter. A crucial part of a mobile transceiver terminal is the generation of local oscillator signals at the desired frequencies that are required for modulation and demodulation. Oscillators will be studied, starting from stability criteria of an electronic system, then leading to criteria for controlled instability or oscillation. Oscillator design will be discussed in detail, including that of crystal controlled oscillators which provide accurate time base. An introduction to phase-locked loops will be made, illustrating how it links a variable frequency oscillator to a very stable fixed frequency crystal oscillator, and how phase detector, charge pump and programmable dividers all serve to realize an agile frequency synthesizer that is very stable in each frequency synthesized. | |||||
Lecture notes | Script with slides and notes is available. | |||||
Prerequisites / Notice | The course Analog Integrated Circuits is recommended as preparation for this course. | |||||
227-0146-00L | Analog-to-Digital Converters | W | 6 credits | 2V + 2U | Q. Huang, T. Burger | |
Abstract | This course provides a thorough treatment of integrated data conversion systems from system level specifications and trade-offs, over architecture choice down to circuit implementation. | |||||
Objective | Data conversion systems are substantial sub-parts of many electronic systems, e.g. the audio conversion system of a home-cinema systems or the base-band front-end of a wireless modem. Data conversion systems usually determine the performance of the overall system in terms of dynamic range and linearity. The student will learn to understand the basic principles behind data conversion and be introduced to the different methods and circuit architectures to implement such a conversion. The conversion methods such as successive approximation or algorithmic conversion are explained with their principle of operation accompanied with the appropriate mathematical calculations, including the effects of non-idealties in some cases. After successful completion of the course the student should understand the concept of an ideal ADC, know all major converter architectures, their principle of operation and what governs their performance. | |||||
Content | - Introduction: information representation and communication; abstraction, categorization and symbolic representation; basic conversion algorithms; data converter application; tradeoffs among key parameters; ADC taxonomy. - Dual-slope & successive approximation register (SAR) converters: dual slope principle & converter; SAR ADC operating principle; SAR implementation with a capacitive array; range extension with segmented array. - Algorithmic & pipelined A/D converters: algorithmic conversion principle; sample & hold stage; pipe-lined converter; multiplying DAC; flash sub-ADC and n-bit MDAC; redundancy for correction of non-idealties, error correction. - Performance metrics and non-linearity: ideal ADC; offset, gain error, differential and integral non-linearities; capacitor mismatch; impact of capacitor mismatch on SAR ADC's performance. - Flash, folding an interpolating analog-to-digital converters: flash ADC principle, thermometer to binary coding, sparkle correction; limitations of flash converters; the folding principle, residue extraction; folding amplifiers; cascaded folding; interpolation for folding converters; cascaded folding and interpolation. - Noise in analog-to-digital converters: types of noise; noise calculation in electronic circuit, kT/C-noise, sampled noise; noise analysis in switched-capacitor circuits; aperture time uncertainty and sampling jitter. - Delta-sigma A/D-converters: linearity and resolution; from delta-modulation to delta-sigma modulation; first-oder delta-sigma modulation, circuit level implementation; clock-jitter & SNR in delta-sigma modulators; second-order delta-sigma modulation, higher-order modulation, design procedure for a single-loop modulator. - Digital-to-analog converters: introduction; current scaling D/A converter, current steering DAC, calibration for improved performance. | |||||
Lecture notes | Handouts of the slides will be distributed. | |||||
Literature | - B. Razavi, Principles of Data Conversion System Design, IEEE Press, 1994 - M. Gustavsson et. al., CMOS Data Converters for Communications, Springer, 2010 - R.J. van de Plassche, CMOS Integrated Analog-to-Digital and Digital-to-Analog Converters, Springer, 2010 | |||||
Prerequisites / Notice | It is highly recommended to attend the course "Analog Integrated Circuits" of Prof. Huang as a preparation for this course. | |||||
227-0148-00L | VLSI III: Test and Fabrication of VLSI Circuits | W | 6 credits | 4G | N. Felber, H. Kaeslin | |
Abstract | This last course in our VLSI series is concerned with the manufacturing of integrated circuits (IC) in CMOS technology, with defects that may occur during the process, and ---above all--- with the methods and tools for detecting design flaws and fabrication defects. | |||||
Objective | Know how to apply methods, software tools and equipment for designing testable VLSI circuits, for testing fabricated ICs, and for physical analysis in the occurrence of defective parts. A basic understanding of modern semiconductor technologies. | |||||
Content | This final course in a series of three focusses on manufacturing, testing, physical analysis, and packaging of VLSI circuits. Future prospects of micro- and nanoelectronics are also being discussed. Topics include: - Effects of fabrication defects. - Abstraction from physical to transistor- and gate-level fault models. - Fault grading in the occurrence of large ASICs. - Generation of efficient test vector sets. - Enhancement of testability with built-in self test. - Organisation and application of automated test equipment. - Physical analysis of devices. - Packaging problems and solutions. - Today's nanometer CMOS fabrication processes (HKMG). - Optical and post optical Photolithography. - Potential alternatives to CMOS technology and MOSFET devices. - Evolution paths for design methodology. - Industrial roadmaps for the future evolution of semiconductor technology (ITRS). Exercises teach students how to use CAE/CAD software and automated equipment for testing ASICs after fabrication. Students that have submitted a design for manufacturing at the end of the 7th term do so on their own circuits. Physical analysis methods with professional equipment (AFM, DLTS) complement this training. | |||||
Lecture notes | English lecture notes. All written documents in English. | |||||
Prerequisites / Notice | Prerequisites: Basics of digital design. Further details: Link | |||||
227-0159-00L | Quantum Transport in Nanoscale Devices | W | 6 credits | 2V + 2U | M. Luisier | |
Abstract | This class offers an introduction into quantum transport theory, a rigorous approach to electron transport at the nanoscale. It covers different topics such as bandstructure, Wave Function and Non-equilibrium Green's Function formalisms, and electron interactions with their environment. Matlab exercises accompany the lectures where students learn how to develop their own transport simulator. | |||||
Objective | The continuous scaling of electronic devices has given rise to structures whose dimensions do not exceed a few atomic layers. At this size, electrons do not behave as particle any more, but as propagating waves and the classical representation of electron transport as the sum of drift-diffusion processes fails. The purpose of this class is to explore and understand the displacement of electrons through nanoscale device structures based on state-of-the-art quantum transport methods and to get familiar with the underlying equations by developing his own nanoelectronic device simulator. | |||||
Content | The following topics will be addressed: - Introduction to quantum transport modeling - Bandstructure representation and effective mass approximation - Open vs closed boundary conditions to the Schrödinger equation - Comparison of the Wave Function and Non-equilibrium Green's Function formalisms as solution to the Schrödinger equation - Self-consistent Schödinger-Poisson simulations - Quantum transport simulations of resonant tunneling diodes and quantum well nano-transistors - Top-of-the-barrier simulation approach to nano-transistor - Electron interactions with their environment (phonon, roughness, impurity,...) - Multi-band transport models | |||||
Lecture notes | Lecture slides are distributed every week and can be found at Link | |||||
Literature | Recommended textbook: "Electronic Transport in Mesoscopic Systems", Supriyo Datta, Cambridge Studies in Semiconductor Physics and Microelectronic Engineering, 1997 | |||||
Prerequisites / Notice | Basic knowledge of semiconductor device physics and quantum mechanics | |||||
227-0456-00L | High Frequency and Microwave Electronics I Does not take place this semester. | W | 6 credits | 4G | C. Bolognesi | |
Abstract | Understanding of basic building blocks of microwave electronics technology, with a focus on active semiconductor devices. | |||||
Objective | Understanding the fundamentals of microwave electronics technology, with emphasis on active components. | |||||
Content | Introduction, microstrip transmission lines, matching, semiconductors, pn-junction, noise, PIN-diode and applications, Schottky diodes and detectors, bipolar transistors and heterojunction bipolar transistors, MESFET physics and properties, high-electron mobility transistors, microwave amplifiers. | |||||
Lecture notes | Script: Mikrowellentechnik and Mikrowellenelektronik, by Werner Bächtold (In German). | |||||
Prerequisites / Notice | The lectures will be held in English. | |||||
227-0198-00L | Wearable Systems II: Design and Implementation | W | 6 credits | 4G | G. Tröster | |
Abstract | Concepts and methods to integrate mobile computers into clothes. Textile sensors: strain, pressure, temperature, ECG, EMG,.. New substrates (eTextile, Smart Textile), organic material (foils) Power and Energy in Wearable Systems Economical conditions Evaluation of research institutions, projects and proposals. | |||||
Objective | To integrate wearable computers also commercially successful in our daily outfit, innovative sensing and communication technologies as well as economical and ethical aspects have to be considered. The course deals with > Textile Sensors: strain, pressure, temperature, ECK, EMG, ... > Packaging: new substrates (eTextiles), organic material (foils) > Power and energy in mobile systems. > Privacy and Ethics Using a business plan we will practice the commercialisation of our 'Wearable Computers'. Supported by a wiki-tool the course is organized as a seminar, in which the addressed topics are jointly discussed considering the aspect 'Concept of a research proposal'. According to the ETH 'critical thinking initiative' we will analyse and reflect implementation concepts incorporating the social and scientific context. Presentations alternate with workshops and discussions. Instead of an oral examination a thesis in a form of a project proposal can be submitted. The audience determines the used language (German or English) | |||||
Content | To integrate wearable computers also commercially successful in our daily outfit, innovative sensing and communication technologies as well as economical and ethical aspects have to be considered. The course deals with > Textile Sensors: strain, pressure, temperature, ECK, EMG, ... > Packaging: new substrates (eTextiles), organic material (foils) > Power and energy in mobile systems. > Privacy and Ethics Using a business plan we will practice the commercialisation of our 'Wearable Computers'. Supported by a wiki-tool the course is organized as a seminar, in which the addressed topics are jointly discussed considering the aspect 'Concept of a research proposal'. According to the ETH 'critical thinking initiative' we will analyse and reflect implementation concepts incorporating the social and scientific context. Presentations alternate with workshops and discussions. Instead of an oral examination a thesis in a form of a project proposal can be submitted. The audience determines the used language (German or English) | |||||
Lecture notes | A wiki-tool will be available for the internal communication; that includes lecture notes for all lessons, assignments and solutions. Link | |||||
Literature | Will be provided in the course material | |||||
Prerequisites / Notice | Supported by a wiki-tool the course is organized as a seminar, in which the addressed topics are jointly discussed considering the aspect 'Concept of a research proposal'. According to the ETH 'critical thinking initiative' we will analyse and reflect implementation concepts incorporating the social and scientific context. Presentations alternate with workshops and discussions. Instead of an oral examination a thesis in a form of a project proposal can be submitted. The audience determines the date and the used language (German or English) No special prerequisites, also not the participation of 'Wearable Systems 1' | |||||
151-0172-00L | Devices and Systems | W | 5 credits | 4G | C. I. Roman, A. Hierlemann | |
Abstract | The students are introduced to the fundamentals and physics of microelectronic devices as well as to microsystems in general (MEMS). They will be able to apply this knowledge for system research and development and to assess and apply principles, concepts and methods from a broad range of technical and scientific disciplines for innovative products. | |||||
Objective | The students are introduced to the fundamentals and physics of microelectronic devices as well as to microsystems in general (MEMS), basic electronic circuits for sensors, RF-MEMS, chemical microsystems, BioMEMS and microfluidics, magnetic sensors and optical devices, and in particular to the concepts of Nanosystems (focus on carbon nanotubes), based on the respective state-of-research in the field. They will be able to apply this knowledge for system research and development and to assess and apply principles, concepts and methods from a broad range of technical and scientific disciplines for innovative products. | |||||
Content | Introduction to semiconductors, MOSFET transistors Basic electronic circuits for sensors and microsystems Transducer Fundamentals Chemical sensors and biosensors, microfluidics and bioMEMS RF MEMS Magnetic Sensors, optical Devices Nanosystem concepts | |||||
Lecture notes | handouts | |||||
227-0150-00L | Advanced System-on-chip Design: Integrated Parallel Computing Architectures | W | 6 credits | 4G | L. Benini | |
Abstract | The course will cover Digital System-on-Chip architectures: multi-cores, many-cores, GP-GPUs and heterogeneous platforms, with an in-depth view on design tools and methods targeting advanced nanometer-scale technology and system integration options. | |||||
Objective | To provide an in-depth understanding of the links and dependencies between architectures and their silicon implementation and to get an exposure to state-of-the-art methodologies for designing complex integrated systems using advanced technologies. Practical experience will also be gained through projects assigned on specific topics. | |||||
Content | The course will cover Digital System-on-Chip architectures, design tools and methods, with an in-depth view on design challenges related to advanced silicon technology and state-of-the-art system integration options (novel storage options, three-dimensional integration, advanced system packaging). The emphasis will be on programmable parallel architectures, namely, multi and many- cores, GPUs, vector accelerators, heterogeneous platforms, and the complex design choices required to achieve scalability and energy proportionality. The course will cover not only circuit, logic and microarchitecture design, but it will also delve into system design, touching on hardware-software tradeoffs and full-system analysis and optimization taking into account non-functional constraints and quality metrics, such as power consumption, thermal dissipation, reliability and variability. | |||||
Lecture notes | Slides will be provided to accompany lectures | |||||
Literature | D. Patterson, J. Hennessy, Computer Architecture, Fifth Edition: A Quantitative Approach (The Morgan Kaufmann Series in Computer Architecture and Design), 2011. D. Patterson, J. Hennessy, Computer Organization and Design, Fifth Edition: The Hardware/Software Interface (The Morgan Kaufmann Series in Computer Architecture and Design), 2013. | |||||
Prerequisites / Notice | Knowledge of digital design at the level of "Design of Digital Circuits SS12" is required. Knowledge of basic VLSI design at the level of "VLSI I: Architectures of VLSI Circuits" is required |
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